Flash brazing of SiC using Ag-Cu-Ti alloy at ultra-low temperature in air via electric field assistance

In this paper, the “flash brazing” of SiC is successfully achieved using Ag-Cu-Ti alloy in air for seconds at an ultra-low furnace temperature of 400 °C. The interface temperature reaches over 900 °C at an ultra-fast rate via the electric field assistance. The microstructure illustrates that SiC reacts with Ag-Cu-Ti alloy to form TiC to achieve the strong bonding of the joint, and the middle part of the joint is composed of silver-based solid solution and copper-based solid solution. With the increase of brazing holding time, the amount of copper-based solid solution in the joint gradually grows, and the shear strength of the joints first increases and then decreases. The maximum strength value of 70 MPa is obtained at 400 °C−10 A-60s. This method could help to improve the efficiency of ceramic bonding greatly.