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Finite Element Modelling of a Piezoelectric MEMS Pressure Sensor using FreeFem++

  • Xiyao Du
  • , Peng Zhou*
  • , Hao Ren
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

MEMS piezoelectric pressure sensors are widely used nowadays due to their small sizes, good performances and reliable qualities. Structural optimization are very important for the design and manufacturing of these sensors. Finite element modelling is usually used to achieve the structural optimization of these sensors. Here, a model of a MEMS piezoelectric pressure sensor is developed using the finite element method. The applied boundary condition on the top surface of the sensor is uniformly distributed pressures; while that on the bottom surface of the sensor is fixed displacements. Then, solving the mechanic equilibrium equations leads to elastic displacements. Thus, the elastic strains and stresses are obtained. Then, the distribution of the elastic stresses is used to determine the electric displacements and the electric field intensity within the PZT layer, using the constitutive relations of the piezoelectric effects. As a result, the average output voltage between the two electrodes can be calculated via integrating the electric field intensity in the PZT layer along its thickness direction. The influences of different thicknesses of the PZT layer and the underlying silicon substrate right below the PZT layer on the average output voltages are investigated. Moreover, modal analyses are also carried out to find the natural frequencies of the sensor.

Original languageEnglish
Title of host publication2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350338812
DOIs
StatePublished - 2023
Event24th International Conference on Electronic Packaging Technology, ICEPT 2023 - Shihezi City, China
Duration: 8 Aug 202311 Aug 2023

Publication series

Name2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023

Conference

Conference24th International Conference on Electronic Packaging Technology, ICEPT 2023
Country/TerritoryChina
CityShihezi City
Period8/08/2311/08/23

Keywords

  • Finite element method
  • PZT layer
  • applied pressure
  • piezoelectric sensor

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