Finite Element Modeling Optimized by Solder Joint Morphology Simulation for Electrical-Magnetic-Thermal-Force Multi-Physical Field Coupling of PCB Assemblies

Analyzed the overall system reliability by coupling the effects of multi-physical field conditions. Proposed a method of finite element multi-physical fields whole-process analysis for soldered printed circuit board assemblies of various devices (BGA, CGA, QFP, SOP, DIP). The calculation is completed through the ANSYS platform, coupling multi-physical fields finite element simulation contains electric-magnetic-thermal-vibration fields. The lowest free energy principle of free liquid surface is introduced to calculate the surface morphology evolution of solder joints. Solidify surface files formed by the morphology simulation, improved the accuracy of the finite element three-dimensional model successfully. Decoupled of multi-physical fields processes by applying magneto-electric fields' thermal and force effects to thermal cycling and vibration analysis, achieved full fields coupled finite analysis. Life prediction was carried out using the mechanical properties obtained from the above finite element calculations through three-interval model, obtained life expectancy results for different types of devices.