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FEM design and experiment of XY motion platform in flip chip machine

  • Lufan Zhang*
  • , Zhili Long
  • , Jiwen Fang
  • , Jiandong Cai
  • , Longsheng Nian
  • *Corresponding author for this work
  • Xi'an Jiaotong University
  • Huazhong University of Science and Technology
  • Harbin Institute of Technology Shenzhen
  • Chinese University of Hong Kong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

XY motion platform in flip chip machine plays a key module to achieve precise positioning in the process of flip chip packaging. The paper presents an XY motion platform structure. The static and modal characteristics of the XY motion platform were calculated by finite element method, and then some important conclusions were obtained. The displacement and stress distribution of XY motion platform were disclosed. The relevant change trends of displacement and stress under the different load were investigated and the first four natural vibration modes of the XY motion platform were obtained. In the experiment, the vibration behavior was measured by a non-contact laser measuring device. The experiments verify the correctness of the simulation of the XY motion platform. These results can help improve the reliability of the XY motion platform.

Original languageEnglish
Title of host publicationAdvances in Mechatronics and Control Engineering
Pages7-13
Number of pages7
DOIs
StatePublished - 2013
Externally publishedYes
Event2012 International Conference on Mechatronics and Control Engineering, ICMCE 2012 - Guangzhou, China
Duration: 29 Nov 201230 Nov 2012

Publication series

NameApplied Mechanics and Materials
Volume278-280
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2012 International Conference on Mechatronics and Control Engineering, ICMCE 2012
Country/TerritoryChina
CityGuangzhou
Period29/11/1230/11/12

Keywords

  • FEM
  • Flip chip
  • Laser doppler vibrometer
  • XY motion platform

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