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FEM design and experiment of a micro-gripper based on piezoelectric material

  • Zhili Long*
  • , Lufan Zhang
  • , Jianguo Zhang
  • *Corresponding author for this work
  • Harbin Institute of Technology Shenzhen
  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Micro-gripper is a key module in IC/LED wire bonding. The paper presents a micro-gripper combining with piezoelectric material and flexible structure. The dynamic and static characteristics of the micro-gripper are calculated by finite element method, and the natural frequencies, the vibration modes, as well as the deflection range of the micro-gripper are obtained. In the experiment, the high-speed camera was used to track the vibration of the micro-gripper, and the relationship between deflection range and driven voltage was established. The vibration behavior was measured by a non-contact laser measuring device. These results can help improve the reliability of the micro-gripper used in wire bonding.

Original languageEnglish
Title of host publicationAdvanced Mechanical Design
Pages434-438
Number of pages5
DOIs
StatePublished - 2012
Externally publishedYes
Event3rd international Conference on Manufacturing Science and Engineering, ICMSE 2012 - Xiamen, China
Duration: 27 Mar 201229 Mar 2012

Publication series

NameAdvanced Materials Research
Volume479-481
ISSN (Print)1022-6680

Conference

Conference3rd international Conference on Manufacturing Science and Engineering, ICMSE 2012
Country/TerritoryChina
CityXiamen
Period27/03/1229/03/12

Keywords

  • Flexible structure
  • Micro-gripper
  • Piezoelectric material
  • Wire bonding

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