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Fabrication of silver/silver-tetracyanoquinodimethane heterogeneous nanowires using nanoskiving method

  • Zhuo Fang
  • , Yongda Yan
  • , Ji Ma
  • , Yang Wang
  • , Yanquan Geng*
  • , Lianhuan Han*
  • , Dongping Zhan
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Xiamen University

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, silver/silver-tetracyanoquinodimethane nanowires with excellent microstructure quality are prepared by combining the nanoskiving method with the solution reaction method, and their electrical properties are tested. The perpendicular cutting direction and larger cutting thickness are beneficial to the acquisition of complete and less deformed silver nanowires. Silver/silver-tetracyanoquinodimethane heterogeneous nanowires can be precisely prepared at small droplet concentration, small droplet volume, and 60 s reaction time. The continuity, dimensions, and formation mechanism of nanowires are characterized by atomic force microscope and scanning electron microscope. Raman spectroscopy and transmission electron microscope revealed the successful formation and core-shell structure of silver-tetracyanoquinodimethane nanowires. The electrical properties of silver/silver-tetracyanoquinodimethane heterostructure nanowires show a typical Schottky barrier using a two-point electrical measurement method. This work lays a solid foundation for promoting the engineering application of silver nanowires and silver/silver-tetracyanoquinodimethane heterogeneous nanowires.

Original languageEnglish
Article number113168
JournalMaterials Characterization
Volume204
DOIs
StatePublished - Oct 2023

Keywords

  • Electrical properties
  • Heterogeneous junction
  • Nano-cutting
  • Nanoskiving
  • Silver nanowires

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