TY - GEN
T1 - Fabrication of a flexible metal/polymer mold with liquid crystal polymer material
AU - Lu, Haijing
AU - Ang, Xiaofang
AU - Liu, Hongping
AU - Sun, Zheng
AU - Wei, Jun
PY - 2010
Y1 - 2010
N2 - A flexible polymer is considered as an alternative of lowcost mold materials. Molds with a high density aspect ratio, smooth surface, vertical sidewalls and lightweight have been fabricated and it is easy-to-use features in the hot embossing process. The fabricated flexible metal/polymer molds are expected to have the same quality as silicon or Ni-mold has. This also indicated that the flexible metal/polymer mold could be used for thermoplastic polymer patterning with high fidelity and low cost. Using the flexible metal/polymer mold, 10um and 5um structures were fabricated.
AB - A flexible polymer is considered as an alternative of lowcost mold materials. Molds with a high density aspect ratio, smooth surface, vertical sidewalls and lightweight have been fabricated and it is easy-to-use features in the hot embossing process. The fabricated flexible metal/polymer molds are expected to have the same quality as silicon or Ni-mold has. This also indicated that the flexible metal/polymer mold could be used for thermoplastic polymer patterning with high fidelity and low cost. Using the flexible metal/polymer mold, 10um and 5um structures were fabricated.
UR - https://www.scopus.com/pages/publications/79951860630
U2 - 10.1109/EPTC.2010.5702667
DO - 10.1109/EPTC.2010.5702667
M3 - 会议稿件
AN - SCOPUS:79951860630
SN - 9781424485604
T3 - 2010 12th Electronics Packaging Technology Conference, EPTC 2010
SP - 379
EP - 382
BT - 2010 12th Electronics Packaging Technology Conference, EPTC 2010
T2 - 12th Electronics Packaging Technology Conference, EPTC 2010
Y2 - 8 December 2010 through 10 December 2010
ER -