TY - GEN
T1 - Fabrication, microstructure and mechanical properties of a SiCw/ZK51A Mg composite by semi-solid extrusion directly following liquid Infiltration
AU - Hu, Lianxi
AU - Yuan, Yuan
AU - Luo, Shoujing
PY - 2006
Y1 - 2006
N2 - A 20vol.%SiCw/ZK51A Mg-based composite was fabricated by the process of semi-solid extrusion directly following liquid infiltration. The microstructure and mechanical properties of the composite were investigated in comparison with its squeeze cast and hot extruded counterpart. The results showed that, by semi-solid extrusion, the SiC whiskers were well aligned and microstructure defects associated with the casting technology were eliminated. In addition, as compared with the conventional hot extrusion, the damage to the SiC whiskers during semi-solid extrusion was reduced significantly. Consequently, the composite fabricated by the semi-solid extrusion presented the best whisker reinforcing effect, with its elastic modulus, 0.2% offset yield strength, and ultimate tensile strength achieving 82.5GPa, 383.6MPa, and 431.8MPa respectively.
AB - A 20vol.%SiCw/ZK51A Mg-based composite was fabricated by the process of semi-solid extrusion directly following liquid infiltration. The microstructure and mechanical properties of the composite were investigated in comparison with its squeeze cast and hot extruded counterpart. The results showed that, by semi-solid extrusion, the SiC whiskers were well aligned and microstructure defects associated with the casting technology were eliminated. In addition, as compared with the conventional hot extrusion, the damage to the SiC whiskers during semi-solid extrusion was reduced significantly. Consequently, the composite fabricated by the semi-solid extrusion presented the best whisker reinforcing effect, with its elastic modulus, 0.2% offset yield strength, and ultimate tensile strength achieving 82.5GPa, 383.6MPa, and 431.8MPa respectively.
KW - Mechanical properties
KW - Mg-based composite
KW - Microstructure
KW - Semi-solid extrusion
UR - https://www.scopus.com/pages/publications/85085717170
U2 - 10.4028/3-908451-26-4.354
DO - 10.4028/3-908451-26-4.354
M3 - 会议稿件
AN - SCOPUS:85085717170
SN - 3908451264
SN - 9783908451266
T3 - Solid State Phenomena
SP - 354
EP - 357
BT - Semi-Solid Processing of Alloys and Composites - Proceedings of the 9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006
PB - Trans Tech Publications Ltd
T2 - 9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006
Y2 - 11 September 2006 through 13 September 2006
ER -