Fabrication and thermal expansion properties of high dense Mo/Cu composites

For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60%, 67% Mo content have been fabricated by the patented squeeze-casting technology. The microstructures and thermal expansion properties of the Mo/Cu composites were investigated. The densifications of the Mo/Cu composites were higher than 99%, and the mean linear coefficients of thermal expansion (CTEs, 20°C-100°C) of Mo/Cu composites ranged from 7.9 × 10^-6/°C to 9.3 × 10^-6/°C and decreased with an increase in volume fraction of Mo content. The CTEs agreed well with predicted values by Kerner's model.