TY - GEN
T1 - Experimental study on laser assisted milling of sintered silicon nitride ceramics
AU - Wang, Xiangwei
AU - Zhang, Hongzhi
AU - Wu, Xuefeng
AU - Wang, Yang
AU - Yang, Lijun
PY - 2012
Y1 - 2012
N2 - Laser assisted milling (LAML) is a potential method for machining difficult-to-machine materials such as superalloys and ceramics, which uses a high power laser to focally heat a workpiece prior to material removal with a traditional cutting tool. A laser assisted milling experimental system was set up to investigate the cutting process of LAML of sintered silicon nitride. Effects of operating parameters on cutting forces, chip morphology, surface roughness and subsurface damage were investigated. The results showed the feasibility and advantages of LAML of ceramics including good surface, decreasing cutting force and tool wear, and no micro-crack zones.
AB - Laser assisted milling (LAML) is a potential method for machining difficult-to-machine materials such as superalloys and ceramics, which uses a high power laser to focally heat a workpiece prior to material removal with a traditional cutting tool. A laser assisted milling experimental system was set up to investigate the cutting process of LAML of sintered silicon nitride. Effects of operating parameters on cutting forces, chip morphology, surface roughness and subsurface damage were investigated. The results showed the feasibility and advantages of LAML of ceramics including good surface, decreasing cutting force and tool wear, and no micro-crack zones.
KW - Ceramic machining
KW - Laser assisted machining
KW - Laser assisted milling
KW - Silicon nitride
UR - https://www.scopus.com/pages/publications/81255149980
U2 - 10.4028/www.scientific.net/AMM.121-126.830
DO - 10.4028/www.scientific.net/AMM.121-126.830
M3 - 会议稿件
AN - SCOPUS:81255149980
SN - 9783037852828
T3 - Applied Mechanics and Materials
SP - 830
EP - 834
BT - Frontiers of Manufacturing and Design Science II
T2 - 2nd International Conference on Frontiers of Manufacturing and Design Science, ICFMD 2011
Y2 - 11 December 2011 through 13 December 2011
ER -