Experimental research on wear mechanism of diamond wheels for grinding C_f/SiC composites grooves

Aiming at the problems of low processing efficiency, low groove shape accuracy and poor surface quality caused by grinding wheel wear in the grinding process of C_f/SiC composite grooves. In this paper, based on the motion mode of grinding wheel grinding, the wear volume formula of grinding wheels was analyzed, and the grinding wheel wear comparison experiment of different bond diamond grinding wheels grinding C_f/SiC composite grooves was carried out, and the more suitable kind of diamond grinding wheel for grinding C_f/SiC composite grooves was selected. From the experimental results, compared with the ceramic-bonded diamond wheel and resin-bonded diamond wheel, the grinding times of electroplated diamond wheel grinding C_f/SiC composites were increased by 20 and 104, respectively, and the surface roughness of the groove was most stable and the processing damage was smallest. Therefore, the best quality of grinding C_f/SiC composites groove was obtained by the electroplated diamond grinding wheel, and its life in grinding C_f/SiC composites was the longest. At the same time, the wear mechanism of the electroplated grinding wheel was explored, the wear on the bottom surface of the electroplated grinding wheel was more serious than that on the circumferential surface. The wear on the bottom surface was mainly wear and tear, and it gradually diffused along the inner diameter of the grinding wheel with the increasing grinding times.