@inproceedings{4081d07a74a5409898ffbc4d6bbd9dc6,
title = "Experimental research on phase-change cooling for high-power chip",
abstract = "Phase-change cooling technology is based on the boiling of refrigerating medium to absorb the heat generated by the electronic chip. It provides higher heat flux dissipation, reduces the refrigerating medium flux and consumes a lower pumping power, compared with single-phase liquid cooling. It also has good temperature uniformity and higher working temperature, which is ideal for energy reuse. Experimental system was designed for phase-change cooling of R123 to analyze the basic conditions required for boiling vaporization. The chip temperature was 70 °C or less when the heat flux was 100 W·cm-2, with the 0.6 mm rectangular micro-channel evaporator. Experiments were conducted to analyze the effects of heat flux, channel dimension, throttling action on the heat transfer effect.",
keywords = "High performance computer, High-power chip, Micro-channel, Phase-change cooling",
author = "Wu, \{Long Sheng\} and X. Zhang and Wang, \{Cheng Jian\} and Wang, \{Zhen Long\}",
note = "Publisher Copyright: {\textcopyright} (2014) Trans Tech Publications, Switzerland.; 2nd International Conference on Machinery, Materials Science and Energy Engineering, ICMMSEE 2014 ; Conference date: 20-09-2014 Through 21-09-2014",
year = "2014",
doi = "10.4028/www.scientific.net/AMM.628.306",
language = "英语",
series = "Applied Mechanics and Materials",
publisher = "Trans Tech Publications Ltd",
pages = "306--310",
editor = "Fangping Zhang",
booktitle = "Materials Science, Mechanical Engineering and Applied Research",
address = "瑞士",
}