Experimental research on grinding technology for SiC aspherical surface

Chun Hui Li; Dian Rong Luan; Li Fei Liu; Fei Hu Zhang; Jiang Chen; Yong Zhang

Experimental research on grinding technology for SiC aspherical surface

Chun Hui Li^*
, Dian Rong Luan
, Li Fei Liu
, Fei Hu Zhang
, Jiang Chen
, Yong Zhang

^*Corresponding author for this work

School of Mechatronics Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

In order to study the effects of grinding parameters on surface quality of SiC material, the effects of different parameters including spindle speed, grinding depth and feed rate on surface roughness were analyzed through plane grinding experiments on DMG mill grinding center. The experimental results revealed that, the surface roughness decreased with the increase of spindle speed, and increased with the increase of grinding depth and feed rate. A group of optimal grinding parameter was chosen for the aspherical grinding experiment, with better surface roughness (0.5150 μm) and surface shape accuracy (4.668 μm) obtained.

Original language	English
Pages (from-to)	35-38
Number of pages	4
Journal	Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering
Volume	32
Issue number	5
State	Published - Oct 2012

Keywords

Grinding
SiC
Surface roughness
Surface shape error

Cite this

@article{820639d27483478994f250d00106a789,

title = "Experimental research on grinding technology for SiC aspherical surface",

abstract = "In order to study the effects of grinding parameters on surface quality of SiC material, the effects of different parameters including spindle speed, grinding depth and feed rate on surface roughness were analyzed through plane grinding experiments on DMG mill grinding center. The experimental results revealed that, the surface roughness decreased with the increase of spindle speed, and increased with the increase of grinding depth and feed rate. A group of optimal grinding parameter was chosen for the aspherical grinding experiment, with better surface roughness (0.5150 μm) and surface shape accuracy (4.668 μm) obtained.",

keywords = "Grinding, SiC, Surface roughness, Surface shape error",

author = "Li, \{Chun Hui\} and Luan, \{Dian Rong\} and Liu, \{Li Fei\} and Zhang, \{Fei Hu\} and Jiang Chen and Yong Zhang",

year = "2012",

month = oct,

language = "英语",

volume = "32",

pages = "35--38",

journal = "Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering",

issn = "1006-852X",

publisher = "Zhengzhou Institute of Abrasives Grinding",

number = "5",

}

TY - JOUR

T1 - Experimental research on grinding technology for SiC aspherical surface

AU - Li, Chun Hui

AU - Luan, Dian Rong

AU - Liu, Li Fei

AU - Zhang, Fei Hu

AU - Chen, Jiang

AU - Zhang, Yong

PY - 2012/10

Y1 - 2012/10

N2 - In order to study the effects of grinding parameters on surface quality of SiC material, the effects of different parameters including spindle speed, grinding depth and feed rate on surface roughness were analyzed through plane grinding experiments on DMG mill grinding center. The experimental results revealed that, the surface roughness decreased with the increase of spindle speed, and increased with the increase of grinding depth and feed rate. A group of optimal grinding parameter was chosen for the aspherical grinding experiment, with better surface roughness (0.5150 μm) and surface shape accuracy (4.668 μm) obtained.

AB - In order to study the effects of grinding parameters on surface quality of SiC material, the effects of different parameters including spindle speed, grinding depth and feed rate on surface roughness were analyzed through plane grinding experiments on DMG mill grinding center. The experimental results revealed that, the surface roughness decreased with the increase of spindle speed, and increased with the increase of grinding depth and feed rate. A group of optimal grinding parameter was chosen for the aspherical grinding experiment, with better surface roughness (0.5150 μm) and surface shape accuracy (4.668 μm) obtained.

KW - Grinding

KW - SiC

KW - Surface roughness

KW - Surface shape error

UR - https://www.scopus.com/pages/publications/84869818058

M3 - 文章

AN - SCOPUS:84869818058

SN - 1006-852X

VL - 32

SP - 35

EP - 38

JO - Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering

JF - Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering

IS - 5

ER -

Experimental research on grinding technology for SiC aspherical surface

Abstract

Keywords

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