Abstract
In this chapter, we outline the revolution of wafer bonding technologies in microelectromechanical systems (MEMS) packaging and their applications in the emerging field of micro/nanofluidics-enhanced sensing. With the rapid development of device miniaturization, high-density assembly technologies have become one of the most important research topics in three-dimensional (3D) integration. The role of packaging has also shifted from initial physical protection and electrical interconnection to a multifunctional platform and/or interfaces. Hence, wafer bonding-based packaging technologies also benefit from diversified applications, e.g., micro/nanofluidics, optoelectronic integration, and biological/chemical sensing. Based on the aforementioned aspects, we summarize the development of wafer bonding technology to enable researchers to know the recent progress of homo-/heterogeneous integration.
| Original language | English |
|---|---|
| Title of host publication | Advanced MEMS/NEMS Fabrication and Sensors |
| Publisher | Springer International Publishing |
| Pages | 187-215 |
| Number of pages | 29 |
| ISBN (Electronic) | 9783030797492 |
| ISBN (Print) | 9783030797485 |
| DOIs | |
| State | Published - 12 Oct 2021 |
Keywords
- Anodic bonding
- Eutectic bonding
- MEMS
- Plasma activated bonding
- Surface activated bonding
- Wafer-level packaging
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