TY - GEN
T1 - Evolution of Cu/Al intermet allic compounds in the copper bump bonds during aging process
AU - Tian, Yanhong
AU - Hang, Chunjin
AU - Wang, Chunqing
AU - Zhou-, Y.
PY - 2007
Y1 - 2007
N2 - Growth of Cu/Al intermet allic compounds (IMCs) at the interface between the copper bond and the Al met allization pad would increase the contact resistance and degrade the bond reliabilities. In this study, the thermosonic copper bump bonds were aged at 250°C for 1 to 196 hours. Then the evolution of Cu/Al IMCs was investigated. Three IMC layers with different colors were found at the Cu/Al interface using the optical microscopy on the xy plane cross-section of the ball bond. The main phases in the Cu/Al IMC are confirmed to be Cu 9Al4, and CuAl2. CuAl is believed to be another phase in the copper bond. During the aging process, Cu/Al IMC grew from the periphery of the bond initially and propagated inward to the centre area later. Moreover, some cavities appeared between the IMC layer and bond bottom from the bond periphery and developed into the centre area.
AB - Growth of Cu/Al intermet allic compounds (IMCs) at the interface between the copper bond and the Al met allization pad would increase the contact resistance and degrade the bond reliabilities. In this study, the thermosonic copper bump bonds were aged at 250°C for 1 to 196 hours. Then the evolution of Cu/Al IMCs was investigated. Three IMC layers with different colors were found at the Cu/Al interface using the optical microscopy on the xy plane cross-section of the ball bond. The main phases in the Cu/Al IMC are confirmed to be Cu 9Al4, and CuAl2. CuAl is believed to be another phase in the copper bond. During the aging process, Cu/Al IMC grew from the periphery of the bond initially and propagated inward to the centre area later. Moreover, some cavities appeared between the IMC layer and bond bottom from the bond periphery and developed into the centre area.
UR - https://www.scopus.com/pages/publications/50449088583
U2 - 10.1109/ICEPT.2007.4441444
DO - 10.1109/ICEPT.2007.4441444
M3 - 会议稿件
AN - SCOPUS:50449088583
SN - 1424413923
SN - 9781424413928
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT
Y2 - 14 August 2007 through 17 August 2007
ER -