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Estimations of Low Temperature Dislocation Mobility in GaN

Research output: Contribution to journalArticlepeer-review

Abstract

The size of dislocation rosettes introduced by indentation in the temperature range from 300 to 773 K are studied. The dislocation velocity and its temperature dependence are estimated. It is shown that the activation energy of dislocation movement at temperatures lower than 773 K does not exceed 1 eV.

Original languageEnglish
Article number1900163
JournalPhysica Status Solidi (A) Applications and Materials Science
Volume216
Issue number17
DOIs
StatePublished - 1 Sep 2019
Externally publishedYes

Keywords

  • GaN
  • activation energy
  • dislocation mobility
  • indentation

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