Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)

H. T. Chen; C. Q. Wang; C. Yan; M. Y. Li; Y. Huang

doi:10.1007/s11664-007-0242-1

Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)

H. T. Chen^*
, C. Q. Wang
, C. Yan
, M. Y. Li
, Y. Huang

^*Corresponding author for this work

Harbin Institute of Technology
The University of Sydney
Harbin Institute of Technology Shenzhen

Research output: Contribution to journal › Comment/debate

1 Scopus citations

Original language	English
Pages (from-to)	1405
Number of pages	1
Journal	Journal of Electronic Materials
Volume	36
Issue number	10
DOIs	https://doi.org/10.1007/s11664-007-0242-1
State	Published - Oct 2007
Externally published	Yes

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10.1007/s11664-007-0242-1

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@article{8a10ade616c242088477540d1668c7eb,

title = "Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)",

author = "Chen, \{H. T.\} and Wang, \{C. Q.\} and C. Yan and Li, \{M. Y.\} and Y. Huang",

year = "2007",

month = oct,

doi = "10.1007/s11664-007-0242-1",

language = "英语",

volume = "36",

pages = "1405",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "10",

}

Chen, HT, Wang, CQ, Yan, C, Li, MY & Huang, Y 2007, 'Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)', Journal of Electronic Materials, vol. 36, no. 10, pp. 1405. https://doi.org/10.1007/s11664-007-0242-1

Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4). / Chen, H. T.; Wang, C. Q.; Yan, C. et al.
In: Journal of Electronic Materials, Vol. 36, No. 10, 10.2007, p. 1405.

Research output: Contribution to journal › Comment/debate

TY - JOUR

T1 - Erratum

T2 - Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)

AU - Chen, H. T.

AU - Wang, C. Q.

AU - Yan, C.

AU - Li, M. Y.

AU - Huang, Y.

PY - 2007/10

Y1 - 2007/10

UR - https://www.scopus.com/pages/publications/34848818510

U2 - 10.1007/s11664-007-0242-1

DO - 10.1007/s11664-007-0242-1

M3 - 评论/辩论

AN - SCOPUS:34848818510

SN - 0361-5235

VL - 36

SP - 1405

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

Erratum: Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging (Journal of Electronic Materials (2002) 25 (162) DOI: 10.1007/s11664-006-0005-4)

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