@article{93797eaa336d402aa70f889df8ae5f8f,
title = "Erratum: An on-wafer embedded passive device using chip-in-substrate packaging technology (Microwave and Optical Technology Letters 58:9)",
author = "Junge Liang and Kim, \{Eun Seong\} and Cong Wang and Youn, \{Je Hyun\} and Park, \{Min Chul\} and Kim, \{Nam Young\}",
year = "2016",
month = jan,
doi = "10.1002/mop.29540",
language = "英语",
volume = "58",
pages = "249",
journal = "Microwave and Optical Technology Letters",
issn = "0895-2477",
publisher = "John Wiley \& Sons Inc.",
number = "1",
}