Erratum: "A novel joint-in-via flip-chip chip-scale package" (IEEE Transactions on Advanced Packaging (2006))

Teck Kheng Lee; Sam Zhang; Chee C. Wong; A. C. Tan

doi:10.1109/TADVP.2006.873918

Erratum: "A novel joint-in-via flip-chip chip-scale package" (IEEE Transactions on Advanced Packaging (2006))

Teck Kheng Lee^*
, Sam Zhang
, Chee C. Wong
, A. C. Tan

^*Corresponding author for this work

School of Astronautics

Nanyang Technological University

Research output: Contribution to journal › Comment/debate

Original language	English
Pages (from-to)	372
Number of pages	1
Journal	IEEE Transactions on Advanced Packaging
Volume	29
Issue number	2
DOIs	https://doi.org/10.1109/TADVP.2006.873918
State	Published - May 2006

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10.1109/TADVP.2006.873918

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author = "Lee, \{Teck Kheng\} and Sam Zhang and Wong, \{Chee C.\} and Tan, \{A. C.\}",

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Erratum: "A novel joint-in-via flip-chip chip-scale package" (IEEE Transactions on Advanced Packaging (2006))

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