Epoxy shape memory polymer (SMP): Material preparation, uniaxial tensile tests and dynamic mechanical analysis

The utilization of epoxy shape memory polymers (SMPs) as engineering materials for deployable structures has attracted considerable attention due to their excellent thermo-mechanical endurance and satisfactory processability. Knowledge of static and dynamic mechanical properties is essential for analyzing structural behavior and recovery, especially for new epoxy SMPs. In this paper, a new epoxy SMP was prepared with epoxy and aromatic amine curing agent. Uniaxial tensile tests and digital image correlation were used to obtain static mechanical properties. Dynamic mechanical analysis was carried out to evaluate glass transition temperatures that corresponded to the heat in the recovery process. It was found that elastic modulus, Poisson's ratio and shear modulus are 1413 MPa, 0.35 and 591 MPa, respectively. The beginning of glass transition temperature of 37.4 °C could be effectively achieved by electrical heaters, validating the shape memory properties of epoxy SMPs. In general, this study could provide useful observations and basic mechanical properties of epoxy SMPs.