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Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming

  • Bingjiang Guo
  • , Liqun Du*
  • , Shuai Wang
  • , Zhongmin Wang
  • , Dong Li
  • , Junshan liu
  • *Corresponding author for this work
  • Dalian University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In order to promote the bubble removal in the fabrication process of micro structure and enhance nickel micro electroforming, megasonic field was introduced in this paper. Electrochemical measurement was used to analyze the effects of megasonic on micro electroforming, including tests on curves of cycle voltammetry, linear sweep voltammetry, Tafel and electrochemical impedance spectroscopy. Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming was revealed and micro structures with different dimensions were fabricated. Results of electrochemical measurement demonstrated that megasonic filed not only can promote the sufficient contact between substrate and electroforming solution, but also can decrease solution resistance and increase current. Besides, megasonic field can promote nickel deposition and weaken hydrogen evolution, improving the current conversion efficiency. Fabrication results verified that megasonic field is beneficial to promote bubble removal from the surface of electroforming area. Less surface defects, higher processing efficiency and higher success rate of micro structures fabrication can be accomplished under 6 W cm−2 megasonic field. This study may provide novel idea and method on fabrication of micro-nano structure.

Original languageEnglish
Article number134109
JournalColloids and Surfaces A: Physicochemical and Engineering Aspects
Volume694
DOIs
StatePublished - 5 Aug 2024
Externally publishedYes

Keywords

  • Bubble removal
  • Electrochemical measurement
  • Megasonic field
  • Micro fabrication
  • Nickel micro electroforming

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