Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching

Diamond/Cu composite materials, with excellent thermal conductivity and adjustable coefficient of thermal expansion, can be applied to various electronic packaging applications. In this study, diamond surfaces were etched via tungsten coating and subsequent calcination. Using these etched diamonds as reinforcements, high thermal conductivity Diamond/Cu composites were successfully fabricated. Compared with non-etched diamonds, the etched diamond-reinforced composites demonstrated significantly improved thermal conductivity and enhanced resistance to thermal cycling. Notably, after 600 thermal shock cycles, the thermal conductivity of the material remained at 597 W/mK, showing only a minor decrease of 6.4 % from its initial value.