Enhanced tensile creep property at 700 °C and microstructure evolution of Ti60 alloy rolled sheet induced by solution-aging treatment

Creep failure is an important failure mode of Ti alloys serving in the aviation field. Therefore, in order to improve the high temperature creep property of Ti alloys. The high temperature tensile creep tests of Ti60 alloy rolled sheet before and after solution-aging treatment were carried out at 700 °C and different stress conditions. The creep stress exponent was obtained, the microstructure was observed, and the evolution behavior of the texture was analyzed. The results show that the creep life of the sample after solution-aging treatment was significantly improved. Taking 700 °C–150 MPa as an example, the creep life was increased from 200 to 8918 min. The creep stress exponent of the sample after solution-aging treatment is 6.74. This shows that at 700 °C, the mechanism of dislocation climbing is dominant, and dislocation slip is secondary. It has a strong {10-12}<10-11> texture after solution-aging treatment. The {10-12}<10-11> texture belongs to twin texture. There are a large number of ∑33c twin boundary in the samples after high temperature solution-aging treatment. The existence of ∑33c twin boundary is helpful to improve the high temperature creep property.