Skip to main navigation Skip to search Skip to main content

Element-based peridynamic model for composite laminates

  • Shuo Liu
  • , Yujie Bian
  • , Lu Che*
  • , Guodong Fang
  • , Jun Liang
  • *Corresponding author for this work
  • Hebei University
  • Northwestern Polytechnical University Xian
  • Yangtze River Delta Research Institute of NPU
  • Beijing Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Traditional peridynamic models encounter numerous limitations when simulating composite laminates, including constraints on material properties, the inability of stiffness to vary continuously with fiber orientation, the absence of stress and strain concepts, as well as issues of numerical instability. This study proposes a composite laminate model based on the element based peridynamics (EBPD). By establishing the in-plane and interlaminar interaction relationships, equilibrium and motion equations, surface correction coefficients, failure criteria and numerical algorithms for laminates, a comprehensive theoretical framework for the EBPD composite laminate model is constructed. The proposed EBPD model is employed to simulate the displacement fields, delamination damage, as well as the strength and failure modes of laminates with different stacking sequences. By comparing its predictions with those of finite element model and experimental results, the capability and applicability of the EBPD model are verified. The results indicate that the proposed EBPD model exhibits advantages in predicting crack propagation issues in composite laminates.

Original languageEnglish
Article number110967
JournalInternational Journal of Mechanical Sciences
Volume308
DOIs
StatePublished - 15 Dec 2025

Keywords

  • Composite laminates
  • Crack propagation
  • Elastic deformation
  • Element-based
  • Nonlocal model
  • Peridynamics

Fingerprint

Dive into the research topics of 'Element-based peridynamic model for composite laminates'. Together they form a unique fingerprint.

Cite this