TY - GEN
T1 - Electroplating enhanced silver nanowire networks for transparent heaters
AU - Wang, Shang
AU - Tian, Yanhong
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - Electroplating Enhanced Silver Nanowire Networks are successfully applied in transparent heaters that ensure the performance of electronic devices under various environmental conditions. Comparing with the simple heating process, the electroplating method can produce an applicable electrode for transparent heaters within a shorter time. The final Ag NWs film products reach 13.2 ?·sq-1 at a transmittance of 80% after electroplating for 10 s. Moreover, the core/shell structure promote the working stability of silver nanowire networks under high-temperature (110°C for 2 h). The high-efficiency method could extend the use of Ag NW films in more potential applied conditions, such as transparent heaters, high-power devices, and solar cells.
AB - Electroplating Enhanced Silver Nanowire Networks are successfully applied in transparent heaters that ensure the performance of electronic devices under various environmental conditions. Comparing with the simple heating process, the electroplating method can produce an applicable electrode for transparent heaters within a shorter time. The final Ag NWs film products reach 13.2 ?·sq-1 at a transmittance of 80% after electroplating for 10 s. Moreover, the core/shell structure promote the working stability of silver nanowire networks under high-temperature (110°C for 2 h). The high-efficiency method could extend the use of Ag NW films in more potential applied conditions, such as transparent heaters, high-power devices, and solar cells.
KW - Flexible electronics
KW - Nickel electroplating
KW - Silver nanowires
KW - Transparent heaters
UR - https://www.scopus.com/pages/publications/85051925371
U2 - 10.1109/ECTC.2018.00263
DO - 10.1109/ECTC.2018.00263
M3 - 会议稿件
AN - SCOPUS:85051925371
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1751
EP - 1756
BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -