Abstract
TiNi films with different Ti/Ni ratios were deposited on Si substrates with and without silicon nitride interlayer. Near-equiatomic TiNi films were found to have the lowest residual stress and the highest recovery stress regardless of the existence of silicon nitride interlayer. The addition of silicon nitride interlayer between film and Si substrate did not cause much change in phase transformation behavior as well as adhesion properties. X-ray photoelectron spectroscopy (XPS) analysis revealed that there is significant interdiffusion of elements and formation of Ti-N and Si-Si bonds at TiNi film/silicon nitride interface. Scratch test results showed that adhesion between the TiNi film and substrate was slightly improved with the increase of Ti content in TiNi films.
| Original language | English |
|---|---|
| Pages (from-to) | 352-357 |
| Number of pages | 6 |
| Journal | Thin Solid Films |
| Volume | 476 |
| Issue number | 2 |
| DOIs | |
| State | Published - 8 Apr 2005 |
| Externally published | Yes |
Keywords
- Adhesion
- Shape memory
- Silicon nitride
- Sputtering
- TiNi
- XPS
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