@inproceedings{d24be750f5ac4ec5b5c93797296460df,
title = "Effects of Si, Cu and Mg on the high-temperature mechanical properties of Al-Si-Cu-Mg alloy",
abstract = "The regression equation of the relationship between Si, Cu and Mg and the mechanical properties of Al-Si-Cu-Mg alloy was established according to the orthogonal experimental results. The microstructure of the Al-Si-Cu-Mg alloy was analyzed with scanning electron microscopy and energy dispersive spectroscopy. The results show that Si, Cu and Mg affected the mechanical properties (tensile strength and elongation rate) at 250 °C most significantly, minimally and negatively, respectively. The interactions between Cu, Mg and Si greatly reduced the high-temperature tensile strength owing to the formation of brittle and hard intermetallic Al5Mg8Cu2Si6. that behaved as the initial crack during stretching.",
keywords = "Al-Si-Cu-Mg alloy, High-temperature mechanical property, Orthogonal array",
author = "Zhang Wenda and Yang Jing and Dang Jingzhi and Liu Yun and Xu Hong",
year = "2013",
doi = "10.4028/www.scientific.net/AMR.652-654.1030",
language = "英语",
isbn = "9783037856208",
series = "Advanced Materials Research",
pages = "1030--1034",
booktitle = "Advances in Materials and Materials Processing",
note = "2012 3rd International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2012 ; Conference date: 22-12-2012 Through 23-12-2012",
}