Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer

Bo Wang; Shaosong Jiang; Kaifeng Zhang

doi:10.1007/s11661-012-1315-1

Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer

Bo Wang^*
, Shaosong Jiang
, Kaifeng Zhang

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 9 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 9 103 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.

Original language	English
Pages (from-to)	3039-3042
Number of pages	4
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	43
Issue number	9
DOIs	https://doi.org/10.1007/s11661-012-1315-1
State	Published - Sep 2012

Access to Document

10.1007/s11661-012-1315-1

Cite this

@article{a69c9ed0614149c5a240bdbffb567508,

title = "Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer",

abstract = "The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 9 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 9 103 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.",

author = "Bo Wang and Shaosong Jiang and Kaifeng Zhang",

year = "2012",

month = sep,

doi = "10.1007/s11661-012-1315-1",

language = "英语",

volume = "43",

pages = "3039--3042",

journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",

issn = "1073-5623",

publisher = "Springer",

number = "9",

}

Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer. / Wang, Bo ; Jiang, Shaosong; Zhang, Kaifeng.
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 43, No. 9, 09.2012, p. 3039-3042.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer

AU - Wang, Bo

AU - Jiang, Shaosong

AU - Zhang, Kaifeng

PY - 2012/9

Y1 - 2012/9

N2 - The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 9 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 9 103 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.

AB - The effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024Al composites sheet were investigated at 853 K (580 C) using a mixed slurry of Al, Cu, and Ti powder interlayer. The process parameters were as follows: the pulse current density of 1.15 9 102 A/mm2, the original pressure of 0.5 MPa, the vacuum of 1.3 9 103 Pa, and the bonding time from 15 to 60 minutes. Moreover, the bonding mechanism in correlation with the microstructural and mechanical properties variation was analyzed.

UR - https://www.scopus.com/pages/publications/84864674932

U2 - 10.1007/s11661-012-1315-1

DO - 10.1007/s11661-012-1315-1

M3 - 文章

AN - SCOPUS:84864674932

SN - 1073-5623

VL - 43

SP - 3039

EP - 3042

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

IS - 9

ER -

Effects of pulse current on transient liquid phase (TLP) diffusion bonding of SiCp/2024al composites sheet using mixed Al, Cu, and Ti powder interlayer

Abstract

Access to Document

Other files and links

Fingerprint

Cite this