Abstract
Co-deposition of Zn-Sn on copper films with an organic additive of gelatin is compared with that without an additive. The study was based on an electrochemical investigation using linear sweep voltammetry and cyclic voltammetry measurements, coupled with scanning electron microscopy and X-ray dispersive analysis of Zn-Sn deposits. The composition of the Zn-Sn alloy was determined in order to study the influence of gelatin. The results indicate that the gelatin strongly influences the cathodic process and the morphology, and it decreases the Sn content in the deposits. It was noted that electrodeposition with gelatin results in smoother, more compact, and more leveled deposits than without it.
| Original language | English |
|---|---|
| Pages (from-to) | 260-262 |
| Number of pages | 3 |
| Journal | Journal of Rare Earths |
| Volume | 24 |
| Issue number | SUPPL. 3 |
| State | Published - Dec 2006 |
Keywords
- Electrodeposition
- Organic additive
- Zn-Sn alloy
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