Abstract
Two different materials for double passivation layers have been implemented to an AlGaN/GaN high electron mobility transistor on Si (111) substrate and the improved DC properties are demonstrated. Si 3N 4 and SiO 2 passivation materials are deposited on the gamma gate upper and bottom layers by plasma enhanced chemical vapor deposition. The gamma shape gate can be made by selectively accurate Si 3N 4 or SiO 2 first passivation dry etching with wet etching. The second passivation on gamma gate effectively increases the DC properties. The effects of DC properties of Si 3N 4 or SiO 2 single passivation and Si 3N 4/Si 3N 4 or SiO 2/SiO 2 double passivations are compared. The Si 3N 4/Si 3N 4 double passivation shows the maximum saturation current density and the peak extrinsic transconductance which increases up to 72% and 18%, respectively, more than Si 3N 4 single passivation and also up to 18% and 5% than SiO 2/SiO 2 double passivation.
| Original language | English |
|---|---|
| Pages (from-to) | 4455-4458 |
| Number of pages | 4 |
| Journal | Thin Solid Films |
| Volume | 520 |
| Issue number | 13 |
| DOIs | |
| State | Published - 30 Apr 2012 |
| Externally published | Yes |
Keywords
- AlGaN/GaN
- High electron mobility transistors
- Passivation
- Plasma enhanced chemical vapor deposition
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