TY - GEN
T1 - Effects of Cu addition on growth of Au-Sn intermetallics at Sn-xCu/Au interface during aging process
AU - Tian, Yanhong
AU - Wang, Chunqing
AU - Liu, Wei
AU - Chen, Yarong
PY - 2007
Y1 - 2007
N2 - The growth of Au-Sn intermetallic compounds (IMCs) is a major concern to the reliabilty of solder joints in microelectronic, optoelectronic and Micro-Electronic-mechanical system (MEMS) which has a layer of Au metallization on the surface of components or leads. This paper presents the growth behavior of Au-Sn IMCs at interfaces of Au metallization and Sn-based solder joints with the addition Cu alloying element during aging process, as shown in Fig. 1, 2 and 3. The coefficients of the Au-Sn IMCs growth were calculated. Results on the interfacial reaction between Sn-xCu solders and Au metallization during aging process show that three thick layers of Au-Sn IMCs including AuSn, AuSn2 and AuSn4 formed at the interface region. The thickness of each Au-Sn IMC layer vs square root of aging time followed linear relationship. Calculation of the IMC growth coefficients show that the diffusion coefficients decrease with the addition Cu elements, which indicates that Cu addition suppresses the growth of Au-Sn IMCs layer.
AB - The growth of Au-Sn intermetallic compounds (IMCs) is a major concern to the reliabilty of solder joints in microelectronic, optoelectronic and Micro-Electronic-mechanical system (MEMS) which has a layer of Au metallization on the surface of components or leads. This paper presents the growth behavior of Au-Sn IMCs at interfaces of Au metallization and Sn-based solder joints with the addition Cu alloying element during aging process, as shown in Fig. 1, 2 and 3. The coefficients of the Au-Sn IMCs growth were calculated. Results on the interfacial reaction between Sn-xCu solders and Au metallization during aging process show that three thick layers of Au-Sn IMCs including AuSn, AuSn2 and AuSn4 formed at the interface region. The thickness of each Au-Sn IMC layer vs square root of aging time followed linear relationship. Calculation of the IMC growth coefficients show that the diffusion coefficients decrease with the addition Cu elements, which indicates that Cu addition suppresses the growth of Au-Sn IMCs layer.
UR - https://www.scopus.com/pages/publications/50249156793
U2 - 10.1109/ICEPT.2007.4441457
DO - 10.1109/ICEPT.2007.4441457
M3 - 会议稿件
AN - SCOPUS:50249156793
SN - 1424413923
SN - 9781424413928
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT
Y2 - 14 August 2007 through 17 August 2007
ER -