@inproceedings{1483777bad8c42289b92f7cc00b6d1eb,
title = "Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability",
abstract = "The effects of cooling processes of the hot bar lift-up time and the silica filler content of solder ACFs polymer resin on the crack formation at SnBi58 solder ACFs joint were investigated to obtain higher solder ACFs joint reliability. As a summary, complete removal of the solder crack at acrylic based ACF joints could be obtained by delaying hot bar lift-up time, until the temperature was cooled below the glass transition temperature of acrylic resin during cooling process, or adding more than 10 wt\% of silica filler content into acrylic resins. Moreover, very reliable solder joint morphology and stable joint contact resistance were obtained after 1000 cycles T/C reliability due to removing solder cracks completely.",
keywords = "Cooling process, Silica filler and reliability, Solder ACFs",
author = "Shuye Zhang and Paik, \{Kyung Wook\}",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 66th IEEE Electronic Components and Technology Conference, ECTC 2016 ; Conference date: 31-05-2016 Through 03-06-2016",
year = "2016",
month = aug,
day = "16",
doi = "10.1109/ECTC.2016.152",
language = "英语",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "737--742",
booktitle = "Proceedings - ECTC 2016",
address = "美国",
}