Effects of acrylic adhesives property and optimized bonding parameters on Sn–58Bi solder joint morphology for flex-on-board assembly

Acrylic resin with a fast curable property has been used in low temperature ACFs applications. However, its poor thermo-mechanical property was a concern for solder ACFs applications. In this study, a novel thermomechanical analysis (TMA) method was introduced to measure its polymer rebound amounts due to pressures removal after a thermo-compression (TC) bonding process. Polymer resin was laminated between two silicon chips (7 ∗ 7 mm²), and then a compressive mode TMA measurement was done on the prepared samples. Constant compressive pressures were applied until the temperature was gradually increased to target temperature, and the forces were removed at the target temperatures. The polymer rebound was measured by monitoring the z-axis dimension change after the compressive forces was removed. In addition, the effects of bonding temperatures (from 150 to 250 °C) and the bonding pressures (1, 2 and 3 MPa) on the SnBi58 (139 °C melting point) solder joints morphologies and joint resistances were evaluated to investigate acrylic resin property and find out the optimized bonding conditions for low Tg acrylic-based solder ACFs applications.