Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu-Pd-Ti filler metals

C. F. Liu; J. Zhang; Y. Zhou; Q. C. Meng; M. Naka

doi:10.1016/j.msea.2008.02.027

Effect of Ti content on microstructure and strength of Si₃N₄/Si₃N₄ joints brazed with Cu-Pd-Ti filler metals

C. F. Liu^*
, J. Zhang
, Y. Zhou
, Q. C. Meng
, M. Naka

^*Corresponding author for this work

Harbin Institute of Technology
The University of Osaka

Research output: Contribution to journal › Article › peer-review

30 Scopus citations

Abstract

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si₃N₄ joints were obtained. The effect of Ti content on the microstructure and properties of the Si₃N₄ joints was investigated using EPMA, SEM and three-point bending method. Results indicate that Ti content in the filler has a great impact upon the microstructure of the joints via exerting an influence on the diffusion and spread of liquid filler alloy on the ceramic surface, and subsequently on the formation of reaction layer. When the Ti content is 15 at.%, both the thickness of reaction layer and the bonding strength reach the maximum value of 8 μm and 155.8 MPa, respectively. Reaction phases (Ti₅Si₃, Pd₂Si and PdTiSi) appear in the joint, moreover, the Cu[Pd] solid solution distribute more homogeneously. All the joints failed along one of the two ceramic/interlayer interfaces.

Original language	English
Pages (from-to)	483-487
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	491
Issue number	1-2
DOIs	https://doi.org/10.1016/j.msea.2008.02.027
State	Published - 15 Sep 2008
Externally published	Yes

Keywords

Bonding strength
Brazing (welding)
Interface
Microstructure
SiN ceramic

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10.1016/j.msea.2008.02.027

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@article{026dda3faca74f6da9c293ee00f03cdf,

title = "Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu-Pd-Ti filler metals",

abstract = "A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si3N4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si3N4 joints was investigated using EPMA, SEM and three-point bending method. Results indicate that Ti content in the filler has a great impact upon the microstructure of the joints via exerting an influence on the diffusion and spread of liquid filler alloy on the ceramic surface, and subsequently on the formation of reaction layer. When the Ti content is 15 at.\%, both the thickness of reaction layer and the bonding strength reach the maximum value of 8 μm and 155.8 MPa, respectively. Reaction phases (Ti5Si3, Pd2Si and PdTiSi) appear in the joint, moreover, the Cu[Pd] solid solution distribute more homogeneously. All the joints failed along one of the two ceramic/interlayer interfaces.",

keywords = "Bonding strength, Brazing (welding), Interface, Microstructure, SiN ceramic",

author = "Liu, \{C. F.\} and J. Zhang and Y. Zhou and Meng, \{Q. C.\} and M. Naka",

year = "2008",

month = sep,

day = "15",

doi = "10.1016/j.msea.2008.02.027",

language = "英语",

volume = "491",

pages = "483--487",

journal = "Materials Science and Engineering: A",

issn = "0921-5093",

publisher = "Elsevier Ltd",

number = "1-2",

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TY - JOUR

T1 - Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu-Pd-Ti filler metals

AU - Liu, C. F.

AU - Zhang, J.

AU - Zhou, Y.

AU - Meng, Q. C.

AU - Naka, M.

PY - 2008/9/15

Y1 - 2008/9/15

N2 - A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si3N4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si3N4 joints was investigated using EPMA, SEM and three-point bending method. Results indicate that Ti content in the filler has a great impact upon the microstructure of the joints via exerting an influence on the diffusion and spread of liquid filler alloy on the ceramic surface, and subsequently on the formation of reaction layer. When the Ti content is 15 at.%, both the thickness of reaction layer and the bonding strength reach the maximum value of 8 μm and 155.8 MPa, respectively. Reaction phases (Ti5Si3, Pd2Si and PdTiSi) appear in the joint, moreover, the Cu[Pd] solid solution distribute more homogeneously. All the joints failed along one of the two ceramic/interlayer interfaces.

AB - A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si3N4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si3N4 joints was investigated using EPMA, SEM and three-point bending method. Results indicate that Ti content in the filler has a great impact upon the microstructure of the joints via exerting an influence on the diffusion and spread of liquid filler alloy on the ceramic surface, and subsequently on the formation of reaction layer. When the Ti content is 15 at.%, both the thickness of reaction layer and the bonding strength reach the maximum value of 8 μm and 155.8 MPa, respectively. Reaction phases (Ti5Si3, Pd2Si and PdTiSi) appear in the joint, moreover, the Cu[Pd] solid solution distribute more homogeneously. All the joints failed along one of the two ceramic/interlayer interfaces.

KW - Bonding strength

KW - Brazing (welding)

KW - Interface

KW - Microstructure

KW - SiN ceramic

UR - https://www.scopus.com/pages/publications/46049120993

U2 - 10.1016/j.msea.2008.02.027

DO - 10.1016/j.msea.2008.02.027

M3 - 文章

AN - SCOPUS:46049120993

SN - 0921-5093

VL - 491

SP - 483

EP - 487

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

IS - 1-2

ER -

Effect of Ti content on microstructure and strength of Si₃N₄/Si₃N₄ joints brazed with Cu-Pd-Ti filler metals

Abstract

Keywords

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