TY - GEN
T1 - Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint
AU - Tian, Dewen
AU - Chen, Hongtao
AU - Wang, Chunqing
PY - 2005
Y1 - 2005
N2 - The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intemetallic compound, fine needle-like AuSn4 was found at the solder/pad interface under as-bonded condition. After aging, Ag3Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic compounds layer became flat and a quaternary intermetallic compound Cu-Sn-Ni-Au appeared between AuSn4 layer and Ni(NiFe) layer. In addition, parts of AuSn4 spalled into the solder bulk with long hour aging. In the shear test, the solder joint exhibited a ductile failure. While in the mechanical shock test, the cracks initiated at the right end of the horizontal pad and propagate through the interfaces between IMCs. Furthermore, the factors dominating the failure mode were investigated which consists of external force and stress distribution, interfacial reaction and strain rate.
AB - The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intemetallic compound, fine needle-like AuSn4 was found at the solder/pad interface under as-bonded condition. After aging, Ag3Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic compounds layer became flat and a quaternary intermetallic compound Cu-Sn-Ni-Au appeared between AuSn4 layer and Ni(NiFe) layer. In addition, parts of AuSn4 spalled into the solder bulk with long hour aging. In the shear test, the solder joint exhibited a ductile failure. While in the mechanical shock test, the cracks initiated at the right end of the horizontal pad and propagate through the interfaces between IMCs. Furthermore, the factors dominating the failure mode were investigated which consists of external force and stress distribution, interfacial reaction and strain rate.
KW - Au/ni
KW - Intermetallic compound (IMC)
KW - Mechanical shock
KW - Sn3.5ag0.75cu
UR - https://www.scopus.com/pages/publications/33846272126
U2 - 10.1109/ICEPT.2005.1564653
DO - 10.1109/ICEPT.2005.1564653
M3 - 会议稿件
AN - SCOPUS:33846272126
SN - 0780394496
SN - 9780780394490
T3 - 2005 6th International Conference on Electronics Packaging Technology
BT - 2005 6th International Conference on Electronics Packaging Technology
T2 - 2005 6th International Conference on Electronics Packaging Technology
Y2 - 30 August 2005 through 2 September 2005
ER -