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Effect of silicon addition and thermal history on the thermal expansion behavior of SiC/Al composites

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Two Al-Si alloys (Al-12Si and Al-20Si) and an industrial pure Al were reinforced with 70vol.% dual-sized SiC particles. The composites experienced annealing treatment, to investigate the effect of silicon addition and thermal history on the thermal expansion behavior of high SiC content aluminum matrix composites. The results showed that silicon additions led to a beneficial reduction in the coefficients of thermal expansion (CTEs) of the composites. In the temperature range between 20°C and 400°C, a continuous increase in CTEs with temperature was observed for SiCp/pure Al composite. However, the CTEs of SiCp/Al-12Si and SiCp/Al-20Si showed the maxima at 350°C and 250°C respectively, then diminished at higher temperatures. This was related to the change of solid solubility of silicon in aluminum at elevated temperatures. The thermal expansion behavior of SiCp/Al composites was also influenced by thermal history. After annealing treatment, the CTEs were reduced when compared with those of as-cast composites. Annealing treatment reduced the original thermal residual stresses, and then altered thermal expansion behavior of the composites.

Original languageEnglish
Title of host publicationProgress in Light Metals, Aerospace Materials and Superconductors
PublisherTrans Tech Publications Ltd
Pages649-652
Number of pages4
EditionPART 2
ISBN (Print)0878494324, 9780878494323
DOIs
StatePublished - 2007
Event2006 Beijing International Materials Week, 2006 BIMW - 2006 Beijing International Conference on Aluminum Materials, BICAM 2006 - Beijing, China
Duration: 25 Jun 200630 Jun 2006

Publication series

NameMaterials Science Forum
NumberPART 2
Volume546-549
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference2006 Beijing International Materials Week, 2006 BIMW - 2006 Beijing International Conference on Aluminum Materials, BICAM 2006
Country/TerritoryChina
CityBeijing
Period25/06/0630/06/06

Keywords

  • Aluminum matrix composites
  • Residual stresses
  • Silicon
  • Thermal expansion

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