TY - GEN
T1 - Effect of protection atmosphere's temperature on morphology of Au-Sn IMCs in laser reflowed micro-solder joints
AU - Liu, Wei
AU - Wang, Chunqing
AU - Sun, Lining
AU - Tian, Yanhong
PY - 2010
Y1 - 2010
N2 - Formation of AuSnx IMCs in laser reflowed solder joints protected by N2 atmosphere at room temperature, 60°C, 100°C and 130°C was investigated respectively. The solder balls were Sn-2.0Ag-0.75Cu-3.0Bi, and 120μm in diameter. The surface finish of one pad in the solder joints was 4.0μmAu/0.1μmNiFe/0.01μmTa, the other pad was made of Cu plated with 3.0μm thickness of Au. The laser reflow time was within 10ms. AuSn4 IMCs and Au-riched phases formed at the interfaces of solder and pads, the AuSn4 was needle-like in morphology in the solder joints protected by N2 atmosphere at room temperature. As the temperature of N2 atmosphere was increased to higher than 100 °C, almost all of the Auriched phases disappeared, more needle-like AuSn 4 IMCs formed at the interface, and orientation of the IMCs changed obviously as compared with that in the solder joints protected by N2 atmosphere at room temperature. The results indicated that the temperature of protection atmosphere would affect the Au-Sn interfacial reaction in the solder joints fabricated by laser reflow process evidently, even the reflow time was shorter than 10ms. Therefore, by regulating the temperature of protection atmosphere, we may control the morphology of Au-Sn IMCs in the laser reflowed micro-solder joints, and achieve solder joints with good properties.
AB - Formation of AuSnx IMCs in laser reflowed solder joints protected by N2 atmosphere at room temperature, 60°C, 100°C and 130°C was investigated respectively. The solder balls were Sn-2.0Ag-0.75Cu-3.0Bi, and 120μm in diameter. The surface finish of one pad in the solder joints was 4.0μmAu/0.1μmNiFe/0.01μmTa, the other pad was made of Cu plated with 3.0μm thickness of Au. The laser reflow time was within 10ms. AuSn4 IMCs and Au-riched phases formed at the interfaces of solder and pads, the AuSn4 was needle-like in morphology in the solder joints protected by N2 atmosphere at room temperature. As the temperature of N2 atmosphere was increased to higher than 100 °C, almost all of the Auriched phases disappeared, more needle-like AuSn 4 IMCs formed at the interface, and orientation of the IMCs changed obviously as compared with that in the solder joints protected by N2 atmosphere at room temperature. The results indicated that the temperature of protection atmosphere would affect the Au-Sn interfacial reaction in the solder joints fabricated by laser reflow process evidently, even the reflow time was shorter than 10ms. Therefore, by regulating the temperature of protection atmosphere, we may control the morphology of Au-Sn IMCs in the laser reflowed micro-solder joints, and achieve solder joints with good properties.
UR - https://www.scopus.com/pages/publications/78449277516
U2 - 10.1109/ICEPT.2010.5582548
DO - 10.1109/ICEPT.2010.5582548
M3 - 会议稿件
AN - SCOPUS:78449277516
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 442
EP - 445
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -