@inproceedings{f783fccb03b84936ac526c42d01ddf3c,
title = "Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder",
abstract = "In this study, Sn-Ag-Cu based nanocomposites with multi-walled carbon nanotubes (MWCNTs) as reinforcements were successfully synthesized using the powder metallurgy technique. Varying weight percentages of MWCNTs were blended together with micron size lead-free solder particles. The blended powder mixtures were then compacted, sintered and finally extruded at room temperature. The extruded materials were then used to characterize the melting point and to prepare lap-shear samples for creep tests. Miniature creep samples were created using a specially designed fixture and static loading creep tests were carried out on the solder joint samples at room temperature at 24N and 36N loads. Creep results showed improved creep resistance with the addition of MWCNTs. An attempt is made in the present study to correlate the variation in weight percentages of reinforcement with the creep properties of the resultant nanocomposite materials.",
author = "Nai, \{S. M.L.\} and J. Wei and M. Gupta",
year = "2006",
doi = "10.1115/IMECE2006-13241",
language = "英语",
isbn = "0791837904",
series = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",
publisher = "American Society of Mechanical Engineers (ASME)",
booktitle = "Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging",
address = "美国",
note = "2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 ; Conference date: 05-11-2006 Through 10-11-2006",
}