TY - GEN
T1 - Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder
AU - Nai, S. M.L.
AU - Wei, J.
AU - Gupta, M.
PY - 2009
Y1 - 2009
N2 - In the present study, using powder metallurgy route, varying volume fraction of ZrO2 stabilized with 8 mol.% of Y2O 3 particulates were incorporated into Sn-3.5Ag-0.7Cu solder to develop nanocomposite solders. The samples were extruded and characterized in terms of microstructural and tensile properties. With the addition of nano length scale reinforcement, the results revealed an improvement in 0.2% yield strength (upto ∼ 39%) and ultimate tensile strength (upto ∼ 43%), when compared with that of monolithic Sn-Ag-Cu solder. An attempt is made in this study to interrelate the tensile behavior of Sn-Ag-Cu with the presence of nano-size reinforcement.
AB - In the present study, using powder metallurgy route, varying volume fraction of ZrO2 stabilized with 8 mol.% of Y2O 3 particulates were incorporated into Sn-3.5Ag-0.7Cu solder to develop nanocomposite solders. The samples were extruded and characterized in terms of microstructural and tensile properties. With the addition of nano length scale reinforcement, the results revealed an improvement in 0.2% yield strength (upto ∼ 39%) and ultimate tensile strength (upto ∼ 43%), when compared with that of monolithic Sn-Ag-Cu solder. An attempt is made in this study to interrelate the tensile behavior of Sn-Ag-Cu with the presence of nano-size reinforcement.
UR - https://www.scopus.com/pages/publications/70149089435
U2 - 10.1115/IMECE2008-66904
DO - 10.1115/IMECE2008-66904
M3 - 会议稿件
AN - SCOPUS:70149089435
SN - 9780791848678
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 1
EP - 4
BT - Electronics and Photonics
PB - American Society of Mechanical Engineers (ASME)
T2 - 2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Y2 - 31 October 2008 through 6 November 2008
ER -