@inproceedings{5e7a368e36164b039d18697bb5c747ba,
title = "Effect of multilayer films and current on IMC formation in solder joints",
abstract = "In this paper, the interfacial reaction of Cu/Sn solder joint was investigated under different structures of the solder and soldering conditions. The monolayer and multilayer Sn thin film solder joint was heated at temperature of 350°C for 3min, 5min, 10min. The result indicated that the multilayer film of Cu/Sn can reduce the diffusion distance between Cu and Sn, which can promote the growth of Cu3Sn. In addition, the current was added while heating the Cu/Sn samples. The heat generated by current can also promote the growth of Cu3Sn. So that the single IMC solder joints can be fabricated in short time.",
keywords = "IMC, current, multilayer films, solder joint",
author = "Wei Liu and Yuzhuo Nie and Chunqing Wang and Yanhong Tian",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046733",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1561--1563",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
address = "美国",
}