Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

A. B. Zhang; B. L. Wang

doi:10.1016/j.tafmec.2015.08.002

Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

A. B. Zhang^*
, B. L. Wang

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
Western Sydney University

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

Original language	English
Pages (from-to)	205-209
Number of pages	5
Journal	Theoretical and Applied Fracture Mechanics
Volume	80
DOIs	https://doi.org/10.1016/j.tafmec.2015.08.002
State	Published - Dec 2015
Externally published	Yes

Keywords

Crack
Maxwell stresses
Piezoelectric
Thermal stress

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10.1016/j.tafmec.2015.08.002

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@article{c9249998803a41aca3158ff1b62a51c6,

title = "Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials",

abstract = "Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.",

keywords = "Crack, Maxwell stresses, Piezoelectric, Thermal stress",

author = "Zhang, \{A. B.\} and Wang, \{B. L.\}",

note = "Publisher Copyright: {\textcopyright} 2015 Elsevier Ltd.",

year = "2015",

month = dec,

doi = "10.1016/j.tafmec.2015.08.002",

language = "英语",

volume = "80",

pages = "205--209",

journal = "Theoretical and Applied Fracture Mechanics",

issn = "0167-8442",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

AU - Zhang, A. B.

AU - Wang, B. L.

PY - 2015/12

Y1 - 2015/12

N2 - Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

AB - Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

KW - Crack

KW - Maxwell stresses

KW - Piezoelectric

KW - Thermal stress

UR - https://www.scopus.com/pages/publications/84947037528

U2 - 10.1016/j.tafmec.2015.08.002

DO - 10.1016/j.tafmec.2015.08.002

M3 - 文章

AN - SCOPUS:84947037528

SN - 0167-8442

VL - 80

SP - 205

EP - 209

JO - Theoretical and Applied Fracture Mechanics

JF - Theoretical and Applied Fracture Mechanics

ER -

Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

Abstract

Keywords

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