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Effect of Magnetic Field on Activation Performance of Silicon/Glass Dielectric Barrier Discharge

  • Mingqiang Pan
  • , Furong Yao
  • , Jizhu Liu
  • , Yangjun Wang
  • , Lining Sun
  • Soochow University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In order to study the influence of the magnetic field on the surface activity of the low-temperature anode bonding material in the dielectric barrier discharge, a dielectric barrier discharge device with and without a magnetic field is used, and the glass in the anode bonding is used as a dielectric barrier material. The results of analysis and characterization using angular contact instrument and surface free energy measuring instrument show that the dielectric angle barrier discharge plasma treatment with and without magnetic field can reduce the contact angle and free energy of the silicon/glass surface. Under the discharge gap of 0.08mm, when the magnetic field is absent, the hydrophilic angle of the glass approaches 0°, and the hydrophilic angle of the silicon wafer is as low as 19°. When the magnetic field is applied, the hydrophilic angle of the glass approaches 0°. The minimum hydrophilic angle of the tablet is up to 14°. By contrast, the hydrophilic angle and free energy of silicon/glass materials treated by a dielectric barrier discharge with magnetic field are better.

Original languageEnglish
Title of host publicationProceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
EditorsFei Xiao, Jun Wang, Lin Chen, Tianchun Ye
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages908-912
Number of pages5
ISBN (Electronic)9781538663868
DOIs
StatePublished - 2 Oct 2018
Externally publishedYes
Event19th International Conference on Electronic Packaging Technology, ICEPT 2018 - Shanghai, China
Duration: 8 Aug 201811 Aug 2018

Publication series

NameProceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018

Conference

Conference19th International Conference on Electronic Packaging Technology, ICEPT 2018
Country/TerritoryChina
CityShanghai
Period8/08/1811/08/18

Keywords

  • anodic bonding
  • dielectric barrier discharge
  • magnetic field

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