TY - GEN
T1 - Effect of laser input energy on wetting areas of solder and formation of intermetallic compounds at Sn-3.5Ag-0.75Cu/Au right-angled joint interface
AU - Liu, Wei
AU - Wang, Chunqing
AU - Li, Mingyu
AU - Ling, Li
PY - 2005
Y1 - 2005
N2 - This paper presents the effect of laser input energy on the wetting areas of solder on pads after first laser reflow, and the formation of IMC (intermetallic compounds) at Sn-3.5Ag-0.75Cu/Au right-angled joint interface during second laser reflow. The results showed that the wetting areas of solder on pads were getting larger with the increase of laser input energy. AuSnx IMC were observed at the interface of solder and the pad finished with 4μmAu/0.1μmTa after second laser reflow, the amount and distribution of IMC was strongly affected by laser input energy. In addition, when the laser input energy was increased, the diffusion of copper at the interface of solder and the pad made of Cu plated with 3μmAu was getting larger, and the AuSnx IMC layers could not be well distinguished as the interface between solder and the pad finished with 4μmAu/0.1 μmTa, which may caused by the increased diffusion of Cu and formation of Cu xSn y or Cu xAu ySn z IMC in the condition of high engergy input.
AB - This paper presents the effect of laser input energy on the wetting areas of solder on pads after first laser reflow, and the formation of IMC (intermetallic compounds) at Sn-3.5Ag-0.75Cu/Au right-angled joint interface during second laser reflow. The results showed that the wetting areas of solder on pads were getting larger with the increase of laser input energy. AuSnx IMC were observed at the interface of solder and the pad finished with 4μmAu/0.1μmTa after second laser reflow, the amount and distribution of IMC was strongly affected by laser input energy. In addition, when the laser input energy was increased, the diffusion of copper at the interface of solder and the pad made of Cu plated with 3μmAu was getting larger, and the AuSnx IMC layers could not be well distinguished as the interface between solder and the pad finished with 4μmAu/0.1 μmTa, which may caused by the increased diffusion of Cu and formation of Cu xSn y or Cu xAu ySn z IMC in the condition of high engergy input.
UR - https://www.scopus.com/pages/publications/33744984820
U2 - 10.1109/AGEC.2005.1452344
DO - 10.1109/AGEC.2005.1452344
M3 - 会议稿件
AN - SCOPUS:33744984820
SN - 0780388062
SN - 9780780388062
T3 - Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
SP - 197
EP - 201
BT - Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
T2 - 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
Y2 - 15 March 2005 through 18 March 2005
ER -