Effect of laser input energy on AuSnx intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads

W. Liu; C. Q. Wang; Y. H. Tian; M. Y. Li

doi:10.1016/S1006-7191(08)60037-X

Effect of laser input energy on AuSn_x intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads

W. Liu^*
, C. Q. Wang
, Y. H. Tian
, M. Y. Li

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Harbin Institute of Technology Shenzhen

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Formation of AuSn_x intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn₄ IMCs were observed at the solder/0.5 μm Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was increased, AuSn₄ IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn₄, AuSn₂, AuSn IMCs, and Au₂Sn phases formed at the interface. Moreover, the content of AuSn_x IMCs, such as, AuSn₄ and AuSn₂, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn₄ IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

Original language	English
Pages (from-to)	183-190
Number of pages	8
Journal	Acta Metallurgica Sinica (English Letters)
Volume	21
Issue number	3
DOIs	https://doi.org/10.1016/S1006-7191(08)60037-X
State	Published - Jun 2008

Keywords

Au films
Intermetallics
Laser soldering

Access to Document

10.1016/S1006-7191(08)60037-X

Cite this

@article{37b352bcba3e489fbc73e4df5f1aad4d,

title = "Effect of laser input energy on AuSnx intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads",

abstract = "Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4, AuSn2, AuSn IMCs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.",

keywords = "Au films, Intermetallics, Laser soldering",

author = "W. Liu and Wang, \{C. Q.\} and Tian, \{Y. H.\} and Li, \{M. Y.\}",

year = "2008",

month = jun,

doi = "10.1016/S1006-7191(08)60037-X",

language = "英语",

volume = "21",

pages = "183--190",

journal = "Acta Metallurgica Sinica (English Letters)",

issn = "1006-7191",

publisher = "Springer Nature",

number = "3",

}

TY - JOUR

T1 - Effect of laser input energy on AuSnx intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads

AU - Liu, W.

AU - Wang, C. Q.

AU - Tian, Y. H.

AU - Li, M. Y.

PY - 2008/6

Y1 - 2008/6

N2 - Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4, AuSn2, AuSn IMCs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

AB - Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4, AuSn2, AuSn IMCs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

KW - Au films

KW - Intermetallics

KW - Laser soldering

UR - https://www.scopus.com/pages/publications/45849153499

U2 - 10.1016/S1006-7191(08)60037-X

DO - 10.1016/S1006-7191(08)60037-X

M3 - 文章

AN - SCOPUS:45849153499

SN - 1006-7191

VL - 21

SP - 183

EP - 190

JO - Acta Metallurgica Sinica (English Letters)

JF - Acta Metallurgica Sinica (English Letters)

IS - 3

ER -

Effect of laser input energy on AuSn_x intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this