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Effect of H2O on the Optical Properties of Silicone Materials: aa hybrid first principle calculation and molecular dynamic simulation study

  • Zhi Liang
  • , Miao Cai
  • , Daoguo Yang
  • , Qiqin Wei
  • , Hu Wang
  • , Peng Cui

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, molecular dynamics simulation method was used to simulate the change in optical properties of organic silicon materials after adsorption H2O by using Materials Studio simulation software. The results show that after the H2O are adsorbed by the silicone material, the main chain of the silicone material molecules breaks and the silicone material molecules react with the H2O to form new chemical bonds. After the water molecules are adsorbed, the reflectance of the material to visible light increases and the transmittance decreases. The more H2O are adsorbed, the smaller light transmittance of the silicon material. In addition, the diffusion characteristics of H2O at different temperatures of silicon materials with different concentrations of water molecules were analyzed. The results show that the molecular thermal motion is aggravated by the increase of temperature, the activity of molecular chains increases in the silicon material model, and the diffusion coefficient of H2O increases with the increasing temperature. At the same temperature, the diffusion coefficient of H2O is determined by the concentration of H2O in the silicone material. This study content is of great significance for analyzing the aging mechanism of silica gel and improving LED reliability.

Original languageEnglish
Title of host publication2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728150642
DOIs
StatePublished - Aug 2019
Externally publishedYes
Event20th International Conference on Electronic Packaging Technology, ICEPT 2019 - Hong Kong, China
Duration: 12 Aug 201915 Aug 2019

Publication series

Name2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019

Conference

Conference20th International Conference on Electronic Packaging Technology, ICEPT 2019
Country/TerritoryChina
CityHong Kong
Period12/08/1915/08/19

Keywords

  • Diffusion characteristics Introduction
  • LED reliability
  • Materials studio
  • Optical properties
  • Silicon materials

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