Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

Hailong Li; Mingliang Fu; Mei Zhu; Rong An; Chunqing Wang; Rui Zhang

doi:10.1109/ICEPT.2013.6756579

Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

Hailong Li
, Mingliang Fu
, Mei Zhu
, Rong An
, Chunqing Wang
, Rui Zhang

Faculty of Life Sciences and Medicine

Harbin Institute of Technology

Research output: Contribution to conference › Paper › peer-review

Abstract

The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu₆Sn₅ particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu ₆Sn₅. This is a unique phenomenon different from traditional thermal aging.

Original language	English
Pages	772-776
Number of pages	5
DOIs	https://doi.org/10.1109/ICEPT.2013.6756579
State	Published - 2013
Event	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China Duration: 11 Aug 2013 → 14 Aug 2013

Conference

Conference	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
Country/Territory	China
City	Dalian
Period	11/08/13 → 14/08/13

Keywords

SAC305
aging
high temperature
needle

Access to Document

10.1109/ICEPT.2013.6756579

Cite this

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title = "Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints",

abstract = "The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu 6Sn5. This is a unique phenomenon different from traditional thermal aging.",

keywords = "SAC305, aging, high temperature, needle",

author = "Hailong Li and Mingliang Fu and Mei Zhu and Rong An and Chunqing Wang and Rui Zhang",

year = "2013",

doi = "10.1109/ICEPT.2013.6756579",

language = "英语",

pages = "772--776",

note = "2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 ; Conference date: 11-08-2013 Through 14-08-2013",

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T1 - Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

AU - Li, Hailong

AU - Fu, Mingliang

AU - Zhu, Mei

AU - An, Rong

AU - Wang, Chunqing

AU - Zhang, Rui

PY - 2013

Y1 - 2013

N2 - The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu 6Sn5. This is a unique phenomenon different from traditional thermal aging.

AB - The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu 6Sn5. This is a unique phenomenon different from traditional thermal aging.

KW - SAC305

KW - aging

KW - high temperature

KW - needle

UR - https://www.scopus.com/pages/publications/84898036157

U2 - 10.1109/ICEPT.2013.6756579

DO - 10.1109/ICEPT.2013.6756579

M3 - 论文

AN - SCOPUS:84898036157

SP - 772

EP - 776

T2 - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Y2 - 11 August 2013 through 14 August 2013

ER -

Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

Abstract

Conference

Keywords

Access to Document

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