Skip to main navigation Skip to search Skip to main content

Effect of heat input on microstructure and tensile properties of 1J50 alloy and 06Cr19Ni10 steel electron beam welds

  • Chen Yang
  • , Guoqing Chen*
  • , Xinyan Teng
  • , Likuo Zhu
  • , Zhanhua Gan
  • , Junhong Zhao
  • , Xuesong Leng
  • *Corresponding author for this work
  • CGN-HIT Advanced Nuclear and New Energy Research Institute
  • Harbin Institute of Technology
  • Harbin Institute of Technology Shenzhen

Research output: Contribution to journalArticlepeer-review

Abstract

This study investigated the effect of heat input on the microstructure and tensile properties of electron beam welded joints between 1J50 soft magnetic alloy and 06Cr19Ni10 stainless steel. The weld zone (WZ) was primarily composed of coarse columnar grains of FeNi solid solution with 6–8 wt% Cr. Segregation of Si and P was detected at grain boundaries. As the heat input decreased from 60.5 J/mm to 38.5 J/mm, the average grain size in the WZ reduced from 42.43 μm to 20.06 μm and the local area fraction of segregated phases decreased from 5.73 % to 1.94 %. These microstructural changes contributed to an increase in joint tensile strength from 396.7 MPa to 426.7 MPa, reaching 98 % of that of the 1J50 base metal (BM). However, the joint produced with the lowest heat input failed prematurely due to incomplete fusion. The reduction in heat input also resulted in the disappearance of fine equiaxed grains in weld center, leading to decreased joint elongation. The microhardness of the WZ was lower than that of both BMs because of the coarse columnar grains.

Original languageEnglish
Article number139636
JournalMaterials Letters
Volume404
DOIs
StatePublished - 1 Feb 2026

Keywords

  • 06Cr19Ni10
  • 1J50
  • Electron beam welding
  • Heat input
  • Microstructure
  • Tensile properties

Fingerprint

Dive into the research topics of 'Effect of heat input on microstructure and tensile properties of 1J50 alloy and 06Cr19Ni10 steel electron beam welds'. Together they form a unique fingerprint.

Cite this