Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

X. D. Liu; Y. D. Han; H. Y. Jing; J. Wei; L. Y. Xu

doi:10.1016/j.msea.2012.10.079

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

X. D. Liu
, Y. D. Han
, H. Y. Jing
, J. Wei
, L. Y. Xu^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

159 Scopus citations

Abstract

Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a SnAgCu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study.

Original language	English
Pages (from-to)	25-32
Number of pages	8
Journal	Materials Science and Engineering: A
Volume	562
DOIs	https://doi.org/10.1016/j.msea.2012.10.079
State	Published - 1 Feb 2013
Externally published	Yes

Keywords

Graphene nanosheets (GNSs)
Lead-free solder
Mechanical properties
Thermal expansion

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10.1016/j.msea.2012.10.079

Cite this

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title = "Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder",

abstract = "Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a SnAgCu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study.",

keywords = "Graphene nanosheets (GNSs), Lead-free solder, Mechanical properties, Thermal expansion",

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doi = "10.1016/j.msea.2012.10.079",

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TY - JOUR

T1 - Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

AU - Liu, X. D.

AU - Han, Y. D.

AU - Jing, H. Y.

AU - Wei, J.

AU - Xu, L. Y.

PY - 2013/2/1

Y1 - 2013/2/1

N2 - Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a SnAgCu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study.

AB - Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a SnAgCu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study.

KW - Graphene nanosheets (GNSs)

KW - Lead-free solder

KW - Mechanical properties

KW - Thermal expansion

UR - https://www.scopus.com/pages/publications/84872423914

U2 - 10.1016/j.msea.2012.10.079

DO - 10.1016/j.msea.2012.10.079

M3 - 文章

AN - SCOPUS:84872423914

SN - 0921-5093

VL - 562

SP - 25

EP - 32

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Abstract

Keywords

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