TY - GEN
T1 - Effect of grain wear on material removal behaviour of sapphire in ultra-precision grinding
AU - Gu, Xingshi
AU - Zhao, Qingliang
AU - Guo, Bing
N1 - Publisher Copyright:
© 2019 European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 19th International Conference and Exhibition, EUSPEN 2019. All rights reserved.
PY - 2019
Y1 - 2019
N2 - In sapphire grinding process, due to the great hardness of sapphire, the severe wear of diamond grinding wheel results in a lower consistency in surface roughness and higher grinding energy. This paper aims to reveal that how the fundamental characteristics, such as critical cutting depth for ductile-brittle transition (DBT), specific energy (Es), and material removal rate (MRR), are varied during grinding influenced by the wear of grinding wheel. To achieve this objective, single grit scratching tests have been conducted. Three grits with different degrees of wear, namely, no wear, micro-fracture, and wear flat, are employed in the scratching process. The critical cutting depth for DBT, Es, MRR and acoustic emission (AE) characterizations of each scratching test with various worn grits are analyzed quantitatively. The effect of grain wear on material removal mechanism of sapphire is discussed based on the experimental results. This work sheds lights on the effect of grain wear on ultra-precision grinding of sapphire which could contribute to the optimizations in views of ductile-regime grinding, energy-saving grinding and time-saving grinding.
AB - In sapphire grinding process, due to the great hardness of sapphire, the severe wear of diamond grinding wheel results in a lower consistency in surface roughness and higher grinding energy. This paper aims to reveal that how the fundamental characteristics, such as critical cutting depth for ductile-brittle transition (DBT), specific energy (Es), and material removal rate (MRR), are varied during grinding influenced by the wear of grinding wheel. To achieve this objective, single grit scratching tests have been conducted. Three grits with different degrees of wear, namely, no wear, micro-fracture, and wear flat, are employed in the scratching process. The critical cutting depth for DBT, Es, MRR and acoustic emission (AE) characterizations of each scratching test with various worn grits are analyzed quantitatively. The effect of grain wear on material removal mechanism of sapphire is discussed based on the experimental results. This work sheds lights on the effect of grain wear on ultra-precision grinding of sapphire which could contribute to the optimizations in views of ductile-regime grinding, energy-saving grinding and time-saving grinding.
KW - Critical cutting depth
KW - Grain wear
KW - Sapphire
KW - Single-grit scratching
KW - Ultra-precision grinding
UR - https://www.scopus.com/pages/publications/85071040939
M3 - 会议稿件
AN - SCOPUS:85071040939
T3 - European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 19th International Conference and Exhibition, EUSPEN 2019
SP - 378
EP - 379
BT - European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 19th International Conference and Exhibition, EUSPEN 2019
A2 - Leach, Richard K.
A2 - Billington, D.
A2 - Nisbet, C.
A2 - Phillips, D.
PB - euspen
T2 - 19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019
Y2 - 3 June 2019 through 7 June 2019
ER -