TY - GEN
T1 - Effect of grain orientation on electromigration degradation in lead-free solder joints
AU - Tian, Yanhong
AU - Qin, Jingkai
AU - He, Xiaobin
AU - Wang, Chunqing
PY - 2012
Y1 - 2012
N2 - EM degradation mechanisms were closely related to Sn-grain orientations at the interface. In multi-grain Sn0.7Cu joints, the Cu plate hollow crack at the cathode caused by the rapid dissolution of cathode IMC and Cu interstitial diffusion to anode lead to electrical failure at an early stage, when the c axis is roughly aligned with the electrical current. Single-grain structure with layered twinning usually appeared in Sn3.0Ag0.5Cu solders, most of them had c axis roughly at a right angle relative to the current direction, in which the rates of IMC dissolution was slow. significant grain structure change are observed in Sn3.0Ag0.5Cu solder joint During EM stress, after EM the number of grain increased with size reduced, twin orientation relationship was weakened and misorientation angle became uniform.
AB - EM degradation mechanisms were closely related to Sn-grain orientations at the interface. In multi-grain Sn0.7Cu joints, the Cu plate hollow crack at the cathode caused by the rapid dissolution of cathode IMC and Cu interstitial diffusion to anode lead to electrical failure at an early stage, when the c axis is roughly aligned with the electrical current. Single-grain structure with layered twinning usually appeared in Sn3.0Ag0.5Cu solders, most of them had c axis roughly at a right angle relative to the current direction, in which the rates of IMC dissolution was slow. significant grain structure change are observed in Sn3.0Ag0.5Cu solder joint During EM stress, after EM the number of grain increased with size reduced, twin orientation relationship was weakened and misorientation angle became uniform.
UR - https://www.scopus.com/pages/publications/84875449638
U2 - 10.1109/ICEPT-HDP.2012.6474795
DO - 10.1109/ICEPT-HDP.2012.6474795
M3 - 会议稿件
AN - SCOPUS:84875449638
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 1080
EP - 1082
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -